Share
Study of Thermal Stability of Ultrafine-Grained Copper by means of Electron Back Scattering Diffraction
MATERIALS TRANSACTIONS
Man, O; Pantelejev, L; Kunz, L, 2010: Study of Thermal Stability of Ultrafine-Grained Copper by means of Electron Back Scattering Diffraction. MATERIALS TRANSACTIONS 51(2), p. 209 - 213, doi: 10.2320/matertrans.MC200909
Research Groups:
- Advanced Instrumentation and Methods for Materials Characterization
- High Performance Materials and Coatings for Industry
- Biophotonics Core Facility
CEITEC authors: